Patent Assignment
Reel/Frame 023181/0492
Assignment of Assignor's Interest
Recorded: 2009-09-02
Pages: 3
Assignor
WANG, CHRISTIAN
Executed: 2009-08-25
Assignee
SONION MEMS A/S
BYLEDDET 12, ROSKILDE, DK-4000, DENMARK
Covered Property
(1)
Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2013
From: PULSE MEMS A/S
To: EPCOS PTE LTD
Reel/Frame 029570/0991 →
Change of Name
Jan 4, 2013
From: SONION MEMS A/S
To: PULSE MEMS A/S
Reel/Frame 029572/0834 →
Assignment of Assignor's Interest
Jan 31, 2017
From: EPCOS PTE LTD
To: TDK CORPORATION
Reel/Frame 041132/0144 →
Assignment of Assignor's Interest
Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →