IP Library › Assignment 029572/0834
Patent Assignment
Reel/Frame 029572/0834

Change of Name

Recorded: 2013-01-04 Pages: 27
Assignor
SONION MEMS A/S
Executed: 2008-06-04
Assignee
PULSE MEMS A/S
C/O PULSE HVT APS, FUGLEVANGSVEJ 45, HORSENS, 8700, DENMARK
Covered Property (1)
Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion
Patent: 8,189,820 →
Application: 12/488,775 →
Publication: US 2009/0316946
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 2, 2009
From: WANG, CHRISTIAN
To: SONION MEMS A/S
Reel/Frame 023181/0492 →
Assignment of Assignor's Interest Jan 4, 2013
From: PULSE MEMS A/S
To: EPCOS PTE LTD
Reel/Frame 029570/0991 →
Assignment of Assignor's Interest Jan 31, 2017
From: EPCOS PTE LTD
To: TDK CORPORATION
Reel/Frame 041132/0144 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →