Patent Assignment
Reel/Frame 029570/0991
Assignment of Assignor's Interest
Recorded: 2013-01-04
Pages: 2
Assignor
PULSE MEMS A/S
Executed: 2012-07-30
Assignee
EPCOS PTE LTD
166 KALLANG WAY, SINGAPORE, 349249, SINGAPORE
Covered Property
(1)
Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 2009
From: WANG, CHRISTIAN
To: SONION MEMS A/S
Reel/Frame 023181/0492 →
Change of Name
Jan 4, 2013
From: SONION MEMS A/S
To: PULSE MEMS A/S
Reel/Frame 029572/0834 →
Assignment of Assignor's Interest
Jan 31, 2017
From: EPCOS PTE LTD
To: TDK CORPORATION
Reel/Frame 041132/0144 →
Assignment of Assignor's Interest
Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →