IP Library › Assignment 023289/0553
Patent Assignment
Reel/Frame 023289/0553

Assignment of Assignor's Interest

Recorded: 2009-09-28 Pages: 2
Assignor
SHIV, LIOR
Executed: 2007-03-06
Assignee
HYMITE A/S
GYDEVANG 39-41, BLDG. E0, ALLEROED, 3450, DENMARK
Covered Property (1)
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Patent: 7,732,240 →
Application: 12/566,136 →
Publication: US 2010/0015734
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Assignment of Assignor's Interest Apr 12, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD
Reel/Frame 028033/0241 →
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0746 →
Change of Name Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →