Patent Assignment
Reel/Frame 028033/0241
Assignment of Assignor's Interest
Recorded: 2012-04-12
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 28, 2009
From: SHIV, LIOR
To: HYMITE A/S
Reel/Frame 023289/0553 →
Assignment of Assignor's Interest
Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0746 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037196/0751 →