Patent Assignment
Reel/Frame 023338/0727
Assignment of Assignor's Interest
Recorded: 2009-10-07
Pages: 18
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2008-10-03
Assignee
APTINA IMAGING CORPORATION
WALKER HOUSE, 87 MARY STREET, GEORGE TOWN, GRAND CAYMAN, KY1-9002, CAYMAN ISLANDS
Covered Properties
(5)
Microelectronic Imagers and Methods for Manufacturing Such Microelectronic Imagers
Systems, methods and devices for a CMOS imager having a pixel output clamp
Application:
11/880,072 →
Publication:
US 2009/0021623
Microelectronic Imager Packages and Associated Methods of Packaging
Application:
11/940,184 →
Publication:
US 2009/0121300
Electromagnetic Interference Shield Structures for Semiconductor Components
Application:
12/057,762 →
Publication:
US 2009/0243012
Embedded Cache Memory in Image Sensors
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2007
From: CHO, TAEHEE; YAN, HAI; ZELEZNIK, CHRISTOPHER; LEE, CHIAJEN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 019600/0566 →
Assignment of Assignor's Interest
Aug 31, 2007
From: CHIA, YONG POO; NEO, YONG LOO; ENG, MEOW KOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 019772/0645 →
Assignment of Assignor's Interest
Nov 14, 2007
From: VOELZ, JAMES L.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020113/0505 →
Assignment of Assignor's Interest
Mar 3, 2008
From: MOULI, CHANDRA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020650/0785 →
Assignment of Assignor's Interest
Mar 28, 2008
From: VANAM, KIRAN KUMAR; GOCHNOUR, DEREK J.; WOOD, ALAN G.; DERDERIAN, JAMES M.
To: MICRON TECHNOLOGY, INC
Reel/Frame 020720/0714 →
Assignment of Assignor's Interest
Oct 23, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034037/0711 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →