IP Library Granted Patent US 7,750,392
Granted Patent B2
US 7,750,392 · App. 12/074,446 · Granted Jul 6, 2010

Embedded cache memory in image sensors

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,750,392
App. No.
12/074,446
Granted
Jul 6, 2010
Kind
B2
Abstract

An embodiment of an embedded cache memory in an image sensor comprises a memory cell array wherein the memory cells are substantially isolated from laterally adjacent memory. The memory cell array includes a plurality of memory cells. Each of the memory cells is formed in a standard CMOS image sensor process without the need for SOI processes. Each cell includes first and second n-type and p-type regions arranged around a vertically integrated gate. Data is written to a cell by causing carriers to accumulate in the body of the device through carrier generation mechanisms that may include impact ionization, band-to-band tunneling and/or channel-initiated secondary hot electrons.

Claims (9)

1. A memory cell comprising:

a first semiconductor region of a first doping type;

a second semiconductor region of a second doping type, the second doping type being different from the first doping type, the second semiconductor region being adjacent to the first semiconductor region;

a third semiconductor region of the first doping type adjacent to the second semiconductor region;

a fourth semiconductor region of the second doping type adjacent to the third semiconductor region; and

a gate extending into the third semiconductor region and having the first and second semiconductor regions on a first side of the gate, having the fourth semiconductor region on a second side of the gate, and having the third semiconductor region on the remaining portions of the gate, each of the semiconductor regions being capacitively coupled to the gate.

2. The memory cell of claim 1 wherein the memory cell is substantially isolated by shallow trench isolation.

3. The memory cell of claim 2 wherein the first and third semiconductor regions are P-type semiconductor and the second and fourth semiconductor regions are N-type semiconductors.

4. The memory cell of claim 1 wherein the first semiconductor region is doped more heavily than the third semiconductor region.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034037/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2009
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 023338/0727 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2008
From: MOULI, CHANDRA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 020650/0785 →