Patent Assignment
Reel/Frame 023438/0409
Assignment of Assignor's Interest
Recorded: 2009-10-29
Received: 2009-10-29
Pages: 31
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2009-06-09
Assignee
MOSAID TECHNOLOGIES INCORPORATED
11 HINES ROAD, SUITE 203, OTTAWA, CAX, K2K 2X1, CANADA
Covered Properties
(4)
Barrier-Metal-Free Copper Damascene Technology Using Atomic Hydrogen Enhanced Reflow
Application:
11/511,652 →
Barrier-Metal-Free Copper Damascene Technology Using Atomic Hydrogen Enhanced Reflow
Application:
10/889,203 →
Barrier-Metal-Free Copper Damascene Technology Using Atomic Hydrogen Enhanced Reflow
Application:
10/122,870 →
Barrier-Metal-Free Copper Damascene Technology Using Atomic Hydrogen Enhanced Reflow
Application:
09/809,670 →