Patent Assignment
Reel/Frame 023488/0661
Assignment of Assignor's Interest
Recorded: 2009-11-09
Pages: 9
Assignors
LIN, XUAN
Executed: 2009-08-12
HURTUBISE, RICHARD
Executed: 2009-08-10
PANECCASIO, VINCENT, JR.
Executed: 2009-08-10
CHEN, QINGYUN
Executed: 2009-08-10
Assignee
ENTHONE INC.
350 FRONTAGE ROAD, WEST HAVEN, CONNECTICUT, 06516
Covered Property
(1)
Copper Deposition for Filling Features in Manufacture of Microelectronic Devices
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Reel/Frame 048233/0141 →
Security Interest
Feb 5, 2019
From: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048261/0110 →
Change of Name
Feb 15, 2019
From: ENTHONE INC.
To: MACDERMID ENTHONE INC.
Reel/Frame 048355/0656 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →