Patent Assignment
Reel/Frame 024045/0710
Assignment of Assignor's Interest
Recorded: 2010-03-09
Pages: 3
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property
(1)
Chip Stack with Differing Chip Package Types
Related Assignments
(10)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2004
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 016037/0464 →
Assignment of Assignor's Interest
Nov 30, 2004
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE.PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP, L.P.
Reel/Frame 016030/0432 →
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Assignment of Assignor's Interest
Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 108 LLC
To: M-RED INC.
Reel/Frame 048662/0318 →
Assignment of Assignor's Interest
Mar 22, 2019
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0830 →