IP Library Assignment 024137/0854
Patent Assignment
Reel/Frame 024137/0854

Assignment of Assignor's Interest

Recorded: 2010-03-25 Pages: 3
Assignor
JOSHI, MUKUL
Executed: 2010-03-23
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Integrated Circuit Packaging System with Interconnect and Method of Manufacture Thereof
Patent: 8,981,577 →
Application: 12/731,045 →
Publication: US 2011/0233748
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0145 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Receiving Party Name on the Cover Sheet Previously Recorded at Reel: 038378 Frame: 0145. Assignor(S) Hereby Confirms the Assignment. Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0001 →