Patent Assignment
Reel/Frame 024434/0379
Agreement of Admission and Dissolution
Recorded: 2010-05-25
Pages: 11
Assignor
EMMA MIXED SIGNAL C.V.
Executed: 2009-02-28
Assignee
ON SEMICONDUCTOR TRADING LTD.
1 LANE HILL, HAMMA BUILDING 3RD FLOOR, HAMILTON, HM 19, BERMUDA
Covered Properties
(3)
Dynamic Thresholding Module with Ir Led Light Source for a Contact Image Sensor
Patent:
6,501,865 →
Application:
09/505,393 →
Modulo Arithmetic
Adc with Dynamic Range Extension
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 16, 2000
From: TANAKA, SATORU C.; TSENG, HSIN FU; TAN, PHENG
To: PERIPHERAL IMAGING CORPORAITON
Reel/Frame 010621/0896 →
Assignment of Assignor's Interest
Oct 10, 2006
From: MATTHEY, MARC
To: EMMA MIXED SIGNAL C.V.
Reel/Frame 018369/0869 →
Assignment of Assignor's Interest
Oct 11, 2006
From: MATTHEY, MARC
To: EMMA MIXED SIGNAL C.V.
Reel/Frame 018372/0897 →
Assignment of Assignor's Interest
Feb 6, 2007
From: CADUFF, CHRISTIAN; CAILLET, REGIS
To: EMMA MIXED SIGNAL C.V.
Reel/Frame 018860/0873 →
Asset Purchase Agreement
Mar 24, 2008
From: PERIPHERAL IMAGING CORPORATION
To: AMI SEMICONDUCTOR, INC.; AMI SEMICONDUCTOR ISRAEL LTD.; EMMA MIXED SIGNAL C.V.
Reel/Frame 020679/0955 →
Security Agreement
Jun 23, 2008
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; AMIS HOLDINGS, INC.; AMI SEMICONDUCTOR, INC.; AMIS FOREIGN HOLDINGS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 021138/0070 →
Bill of Sale
May 26, 2010
From: AMI SEMICONDUCTOR, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 024445/0172 →
Assignment of Assignor's Interest
Jun 26, 2012
From: ON SEMICONDUCTOR TRADING, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 028447/0926 →
Corrective Assignment to Correct the Include Exhibit a and Exhibit B Previously Recorded at Reel: 024434 Frame: 0379. Assignor(S) Hereby Confirms the Agreement of Admission and Dissolution.
Mar 9, 2016
From: EMMA MIXED SIGNAL C.V.
To: ON SEMICONDUCTOR TRADING, LTD.
Reel/Frame 038042/0802 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Release of Security Interest
May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Assignment of Assignor's Interest
Aug 1, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: K/S HIMPP
Reel/Frame 039299/0328 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →