Patent Assignment
Reel/Frame 024752/0718
Assignment of Assignor's Interest
Recorded: 2010-07-28
Pages: 4
Assignors
DAUBENSPECK, TIMOTHY H.
Executed: 2010-07-27
GAMBINO, JEFFREY P.
Executed: 2010-07-27
MUZZY, CHRISTOPHER D.
Executed: 2010-07-27
SAUTER, WOLFGANG
Executed: 2010-07-27
SULLIVAN, TIMOTHY D.
Executed: 2010-07-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Integrated Circuit Structure Incorporating a Conductor Layer with Both Top Surface and Sidewall Passivation and a Method of Forming the Integrated Circuit Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest
Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →