Patent Assignment
Reel/Frame 024872/0181
Assignment of Assignor's Interest
Recorded: 2010-08-23
Pages: 4
Assignors
AIBA, AKIHIRO
Executed: 2004-01-30
OKABE, TAKEO
Executed: 2004-01-30
SEKIGUCHI, JUNNOSUKE
Executed: 2004-01-30
Assignee
NIKKO MATERIALS COMPANY, LIMITED
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-8407, JAPAN
Covered Property
(1)
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 24, 2010
From: NIKKO MATERIALS COMPANY, LIMITED
To: NIPPON MINING & METALS CO., LTD
Reel/Frame 024875/0889 →
Merger
Oct 8, 2010
From: NIPPON MINING & METALS CO., LTD.
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 025115/0675 →
Change of Name
Oct 12, 2010
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 025123/0420 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →