Patent Assignment
Reel/Frame 024875/0889
Change of Name
Recorded: 2010-08-24
Pages: 13
Assignor
NIKKO MATERIALS COMPANY, LIMITED
Executed: 2006-04-03
Assignee
NIPPON MINING & METALS CO., LTD
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-0001, JAPAN
Covered Property
(1)
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 23, 2010
From: AIBA, AKIHIRO; OKABE, TAKEO; SEKIGUCHI, JUNNOSUKE
To: NIKKO MATERIALS COMPANY, LIMITED
Reel/Frame 024872/0181 →
Merger
Oct 8, 2010
From: NIPPON MINING & METALS CO., LTD.
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 025115/0675 →
Change of Name
Oct 12, 2010
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 025123/0420 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →