Patent Assignment
Reel/Frame 024940/0475
Assignment of Assignor's Interest
Recorded: 2010-09-03
Pages: 5
Assignors
PAGAILA, REZA A.
Executed: 2010-09-03
CHOW, SENG GUAN
Executed: 2010-09-03
YOON, SEUNG UK
Executed: 2010-09-03
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2014
From: DO, BYUNG TAI; CHUA, LINDA PEI EE
To: STATS CHIPPAC, LTD.
Reel/Frame 034603/0881 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0244 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
Corrective Assignment to Correct the Assignee's Name on the Cover Sheet from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 038378 Frame 0244. Assignor(S) Hereby Confirms the Change of Name.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065239/0786 →