Patent Assignment
Reel/Frame 024987/0833
Merger
Recorded: 2010-09-15
Pages: 24
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties
(8)
Semiconductor Device
Image Processing Device and Data Processor
Application:
12/566,123 →
Publication:
US 2010/0088493
Multi-Core Microcontroller Having Comparator for Checking Processing Result
Semiconductor Device and Manufacturing Method Thereof
Application:
12/628,364 →
Publication:
US 2010/0140711
Semiconductor Device and Method of Manufacturing the Same
Led Driving Circuit, Semiconductor Element and Image Display Device
Application:
12/683,697 →
Publication:
US 2010/0177127
Semiconductor Device
Application:
12/691,168 →
Publication:
US 2010/0181628
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 16, 2009
From: HASHIMOTO, TAKAYUKI; HIRAO, TAKASHI; AKIYAMA, NOBORU
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023521/0400 →
Corrective Assignment to Correct the Application S
Dec 15, 2009
From: TAKAHASHI, YOSHITAKA; MURAMATSU, SHOJI; NAKAMIKAWA, TETSUAKI; HAMASAKI, HIROYUKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023653/0132 →
Corrective Assignment to Correct the Application Serial Number, Previously Recorded on Reel 023653 Frame 0132. Assignor(S) Hereby Confirms the Assignment to Renesas Technology Corp.
Dec 16, 2009
From: TAKAHASHI, YOSHITAKA; MURAMATSU, SHOJI; NAKAMIKAWA, TETSUAKI; HAMASAKI, HIROYUKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023659/0408 →
Assignment of Assignor's Interest
Jan 4, 2010
From: YAMADA, HIROMICHI; SHIMAMURA, KOTARO; HAGIWARA, KESAMI; KIYOSHIGE, YOSHIKAZU
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023729/0048 →
Assignment of Assignor's Interest
Jan 7, 2010
From: AKIYAMA, NOBORU; HASHIMOTO, TAKAYUKI; HIRAO, TAKASHI; MATSUURA, NOBUYOSHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023747/0488 →
Assignment of Assignor's Interest
Jan 13, 2010
From: ISHITSUKA, NORIO; OHTA, HIROYUKI; KIMURA, YASUHIRO; YAMAGUCHI, NATSUO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023776/0537 →
Assignment of Assignor's Interest
Jan 25, 2010
From: KAJIWARA, RYOICHI; MOTOWAKI, SHIGEHISA; ITO, KAZUTOSHI; ISHII, TOSHIAKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023837/0622 →
Assignment of Assignor's Interest
Jan 25, 2010
From: KAWANO, KENYA; ASHIDA, KISHO; MUTO, KUNIHARU; SHIMIZU, ICHIO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023838/0083 →
Assignment of Assignor's Interest
Feb 23, 2010
From: KAWASHITA, MICHIHIRO; YOSHIMURA, YASUHIRO; TANAKA, NAOTAKA; NAITO, TAKAHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 023977/0058 →
Change of Name
Sep 15, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024988/0161 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →