Patent Assignment
Reel/Frame 025457/0789
Assignment of Assignor's Interest
Recorded: 2010-12-06
Pages: 7
Assignors
CHOW, SENG GUAN
Executed: 2010-12-02
LIM, LEE SUN
Executed: 2010-12-02
HUANG, RUI
Executed: 2010-12-02
BAO, XUSHENG
Executed: 2010-12-02
HLAING, MA PHOO PWINT
Executed: 2010-12-02
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Openings Through Encapsulant to Reduce Warpage and Stress on Semiconductor Package
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →