Patent Assignment
Reel/Frame 025470/0077
Assignment of Assignor's Interest
Recorded: 2010-12-10
Pages: 5
Assignors
LIN, YAOJIAN
Executed: 2010-12-09
CHEN, KANG
Executed: 2010-12-09
FANG, JIANMIN
Executed: 2010-12-09
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Corrective Assignment to Correct the the Assignee Name Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Assignment.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067556/0715 →