IP Library Assignment 067556/0715
Patent Assignment
Reel/Frame 067556/0715

Corrective Assignment to Correct the the Assignee Name Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2024-05-29 Pages: 10
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties (6)
Semiconductor Device and Method of Forming Channels in Back Surface of FO-WLCSP for Heat Dissipation
Patent: 9,431,316 →
Application: 12/773,669 →
Publication: US 2011/0272824
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure
Patent: 9,601,434 →
Application: 12/964,823 →
Publication: US 2012/0146236
Semiconductor Device and Method of Forming 3D Semiconductor Package with Semiconductor Die Stacked Over Semiconductor Wafer
Patent: 9,391,046 →
Application: 13/112,172 →
Publication: US 2012/0292745
Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVs in Peripheral Region of the Die
Patent: 9,236,352 →
Application: 13/334,556 →
Publication: US 2012/0091567
Semiconductor Device Including Pre-Fabricated Shielding Frame Disposed Over Semiconductor Die
Patent: 9,406,619 →
Application: 13/350,692 →
Publication: US 2012/0112328
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit
Patent: 9,269,598 →
Application: 13/569,105 →
Publication: US 2012/0292738
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2010
From: PAGAILA, REZA A.
To: STATS CHIPPAC, LTD.
Reel/Frame 024334/0041 →
Assignment of Assignor's Interest Dec 10, 2010
From: LIN, YAOJIAN; CHEN, KANG; FANG, JIANMIN
To: STATS CHIPPAC, LTD.
Reel/Frame 025470/0077 →
Assignment of Assignor's Interest May 20, 2011
From: PARK, YEONGIM; CHI, HEEJO; LEE, HYUNGMIN
To: STATS CHIPPAC, LTD.
Reel/Frame 026314/0467 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →
Release of Security Interest Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →