Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
View Patent ↗A semiconductor device has a first conductive layer formed over a sacrificial substrate. A first integrated passive device (IPD) is formed in a first region over the first conductive layer. A conductive pillar is formed over the first conductive layer. A high-resistivity encapsulant greater than 1.0 kohm-cm is formed over the first IPD to a top surface of the conductive pillar. A second IPD is formed over the encapsulant. The first encapsulant has a thickness of at least 50 micrometers to vertically separate the first and second IPDs. An insulating layer is formed over the second IPD. The sacrificial substrate is removed and a second semiconductor die is disposed on the first conductive layer. A first semiconductor die is formed in a second region over the substrate. A second encapsulant is formed over the second semiconductor die and a thermally conductive layer is formed over the second encapsulant.
1. A semiconductor device, comprising:
a first integrated passive device (IPD) formed in a first region of the semiconductor device;
a conductive pillar formed over a surface of the first IPD;
a semiconductor die disposed in a second region of the semiconductor device laterally offset from the first IPD;
a first encapsulant deposited over the first IPD and semiconductor die;
an insulating layer formed over the first encapsulant; and
a second IPD formed over the first encapsulant and insulating layer opposite the first IPD to reduce inter-device interference between the first IPD and second IPD.
2. The semiconductor device of claim 1 , wherein the first IPD and second IPD include a resistor, capacitor, or inductor.
3. The semiconductor device of claim 1 , further including a semiconductor component disposed over a surface of the semiconductor device opposite the second IPD.
4. The semiconductor device of claim 3 , further including a second encapsulant formed over the semiconductor component.
5. The semiconductor device of claim 1 , wherein the first encapsulant includes a resistivity greater than 1.0 kohm-cm.
6. The semiconductor device of claim 1 , wherein the first IPD is separated from the second IPD by a thickness of at least 50 micrometers.
7. A semiconductor device, comprising:
a first integrated passive device (IPD) formed in a first region of the semiconductor device;
a conductive pillar formed in a peripheral region of the first IPD and extending above the first IPD;
a first semiconductor die disposed in a second region of the semiconductor device laterally offset from the first IPD;
an encapsulant deposited over the first IPD, first semiconductor die, and conductive pillar;
an insulating layer formed over the encapsulant; and
a second IPD formed over the encapsulant and insulating layer opposite the first IPD to reduce inter-device interference between the first IPD and second IPD.
8. The semiconductor device of claim 7 , further including a second semiconductor die disposed over a surface of the semiconductor device opposite the second IPD.
9. The semiconductor device of claim 7 , wherein the first IPD and second IPD include a resistor, capacitor, or inductor.
10. The semiconductor device of claim 7 , further including a heat sink disposed over a surface of the semiconductor device.
11. The semiconductor device of claim 7 , wherein the first IPD or second IPD includes a high frequency IPD and the first semiconductor die includes a baseband component.
12. The semiconductor device of claim 7 , wherein the encapsulant includes a resistivity greater than 1.0 kohm-cm.
13. The semiconductor device of claim 7 , wherein the encapsulant includes a thickness of at least 50 micrometers.
14. A semiconductor device, comprising:
a first integrated passive device (IPD) formed in a first region of the semiconductor device;
a conductive pillar formed over a surface of the first IPD;
a semiconductor die disposed in a second region of the semiconductor device laterally offset from the first IPD;
a single encapsulant layer deposited over the first IPD and around the semiconductor die;
an insulating layer formed over the single encapsulant layer; and
a second IPD formed over the single encapsulant layer and insulating layer opposite the first IPD to reduce inter-device interference between the first IPD and second IPD.
15. The semiconductor device of claim 14 , wherein the first IPD is separated from the second IPD by at least 50 micrometers.
16. The semiconductor device of claim 14 , wherein the first IPD and second IPD include a resistor, capacitor, or inductor.
17. The semiconductor device of claim 14 , further including a semiconductor component disposed over a surface of the semiconductor device.
18. The semiconductor device of claim 14 , wherein the first IPD or second IPD includes a high frequency IPD and the semiconductor die includes a baseband component.
19. The semiconductor device of claim 14 , wherein the single encapsulant layer includes a resistivity greater than 1.0 kohm-cm.