IP Library › Assignment 025798/0812
Patent Assignment
Reel/Frame 025798/0812

Assignment of Assignor's Interest

Recorded: 2011-02-11 Pages: 5
Assignors
CHERN, CHYI SHYUAN
Executed: 2011-02-08
FU, WEN-CHIEN
Executed: 2011-02-08
HSIA, HSING-KUO
Executed: 2011-02-08
YU, CHIH-KUANG
Executed: 2011-02-08
CHIU, CHING-HUA
Executed: 2011-02-08
KUO, HUNG-YI
Executed: 2011-02-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method of Forming a Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding
Patent: 8,236,584 →
Application: 13/025,975 →
Publication: US 2012/0205694
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027900/0139 →
Assignment of Assignor's Interest Dec 5, 2015
From: LTD., CHIP STAR
To: EPISTAR CORPORATION
Reel/Frame 037219/0936 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0790 →