IP Library › Assignment 027900/0139
Patent Assignment
Reel/Frame 027900/0139

Assignment of Assignor's Interest

Recorded: 2012-03-21 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Method of Forming a Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding
Patent: 8,236,584 →
Application: 13/025,975 →
Publication: US 2012/0205694
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 11, 2011
From: CHERN, CHYI SHYUAN; FU, WEN-CHIEN; HSIA, HSING-KUO; YU, CHIH-KUANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025798/0812 →
Assignment of Assignor's Interest Dec 5, 2015
From: LTD., CHIP STAR
To: EPISTAR CORPORATION
Reel/Frame 037219/0936 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0790 →