Patent Assignment
Reel/Frame 037805/0790
Change of Name
Recorded: 2016-02-23
Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Property
(1)
Method of Forming a Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 11, 2011
From: CHERN, CHYI SHYUAN; FU, WEN-CHIEN; HSIA, HSING-KUO; YU, CHIH-KUANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025798/0812 →
Assignment of Assignor's Interest
Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027900/0139 →
Assignment of Assignor's Interest
Dec 5, 2015
From: LTD., CHIP STAR
To: EPISTAR CORPORATION
Reel/Frame 037219/0936 →