Patent Assignment
Reel/Frame 037219/0936
Assignment of Assignor's Interest
Recorded: 2015-12-05
Pages: 4
Assignor
LTD., CHIP STAR
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method of Forming a Light Emitting Diode Emitter Substrate with Highly Reflective Metal Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 11, 2011
From: CHERN, CHYI SHYUAN; FU, WEN-CHIEN; HSIA, HSING-KUO; YU, CHIH-KUANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025798/0812 →
Assignment of Assignor's Interest
Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027900/0139 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0790 →