Patent Assignment
Reel/Frame 026151/0840
Assignment of Assignor's Interest
Recorded: 2011-04-19
Pages: 3
Assignors
ALVARADO, REYNANTE
Executed: 2007-11-26
LU, YUAN
Executed: 2007-10-08
REDBURN, RICHARD
Executed: 2007-10-08
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 EAST UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Solder Bump Interconnect
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 19, 2011
From: ALVARADO, REYNANTE; LU, JUAN; REDBURN, RICHARD
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 026152/0680 →
This Submission Is to Correct Error in Cover Sheet Previously Recorded at Reel/Frame 026152/0680: Correction Is to Spelling of Assignor's Name.
Apr 20, 2011
From: ALVARADO, REYNANTE; LU, YUAN; REDBURN, RICHARD
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 026159/0484 →
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest
Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →
Assignment of Assignor's Interest
Jun 17, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 056612/0882 →