Patent Assignment
Reel/Frame 026245/0686
Assignment of Assignor's Interest
Recorded: 2011-05-09
Pages: 10
Assignors
UHLIG, ALBRECHT
Executed: 2011-02-24
GAIDA, JOSEF
Executed: 2011-02-25
SUCHENTRUNK, CHRISTOF
Executed: 2011-02-25
BOYLE, MICHAEL
Executed: 2011-02-16
WASHO, BRIAN
Executed: 2011-02-16
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Stress-Reduced Ni-P/Pd Stacks for Bondable Wafer Surfaces
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →