Patent Assignment
Reel/Frame 026370/0689
Assignment of Assignor's Interest
Recorded: 2011-06-01
Pages: 8
Assignors
LIAO, CHIEN-KO
Executed: 2007-08-07
CHIU, CHIN-TIEN
Executed: 2007-08-07
CHIEN, JACK CHANG
Executed: 2007-08-07
YU, CHEEMEN
Executed: 2007-08-16
TAKIAR, HEM
Executed: 2007-08-28
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Semiconductor Die Having a Redistribution Layer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2012
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 027508/0069 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0850 →
Assignment of Assignor's Interest
Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
Assignment of Assignor's Interest
Jun 20, 2022
From: WODEN TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0902 →