IP Library › Assignment 027508/0069
Patent Assignment
Reel/Frame 027508/0069

Assignment of Assignor's Interest

Recorded: 2012-01-10 Pages: 88
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75027
Covered Property (1)
Semiconductor Die Having a Redistribution Layer
Patent: 8,212,360 →
Application: 13/103,792 →
Publication: US 2011/0210446
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2011
From: LIAO, CHIEN-KO; CHIU, CHIN-TIEN; CHIEN, JACK CHANG; YU, CHEEMEN
To: SANDISK CORPORATION
Reel/Frame 026370/0689 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0850 →
Assignment of Assignor's Interest Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
Assignment of Assignor's Interest Jun 20, 2022
From: WODEN TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0902 →