Semiconductor die having a redistribution layer
View Patent ↗A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.
1. A portable memory, comprising:
a substrate;
a semiconductor die affixed to the substrate, the semiconductor die including a redistribution pattern, the redistribution pattern including:
an adhesive material adhered to a surface of the semiconductor die in a pattern of the redistribution pattern, and
conductive material deposited on the adhesive material.
2. A portable memory as recited in claim 1 , wherein the semiconductor die is a flash memory die.
3. A portable memory as recited in claim 1 , wherein the semiconductor die is a controller die.
4. A portable memory as recited in claim 1 , wherein the conductive material is at least one of titanium and aluminum.
5. A portable memory as recited in claim 1 , further comprising molding compound for encapsulating the semiconductor die and at least a portion of the substrate.
6. A portable memory, comprising:
a substrate;
a semiconductor die affixed to the substrate, the semiconductor die including a die bond pad at a first location, and a pattern for electrically coupling the die bond pad to a second location on the semiconductor die spaced from the first location, the pattern including:
an adhesive material adhered to a surface of the semiconductor die, and
conductive material deposited on the adhesive material.
7. A portable memory as recited in claim 6 , wherein the pattern is defined by a cured portion of the adhesive material.
8. A portable memory as recited in claim 7 , further comprising uncured portions of adhesive material outside of the pattern.
9. A portable memory as recited in claim 6 , wherein the adhesive material is formed as part of a backgrind tape applied to the portable memory during fabrication.
10. A portable memory as recited in claim 6 , wherein the conductive material deposited on the adhesive material is one of aluminum, titanium and alloys of aluminum and titanium.
11. A portable memory as recited in claim 6 , wherein the pattern is heated by laser.
12. A portable memory as recited in claim 6 , wherein the adhesive material is part of a layer of adhesive material, the adhesive material included in the pattern being heated and cured onto the semiconductor die.
13. A portable memory as recited in claim 12 , wherein unheated portions of the adhesive layer are removed.
14. A portable memory as recited in claim 12 , wherein the heated material is heated by a laser.
15. A portable memory as recited in claim 12 , wherein the pattern is a redistribution pattern.