Patent Assignment
Reel/Frame 026528/0038
Assignment of Assignor's Interest
Recorded: 2011-06-30
Pages: 4
Assignors
KIM, KYUNGOE
Executed: 2007-06-29
KANG, TAEWOO
Executed: 2007-06-29
SHIN, HYUNSU
Executed: 2011-05-30
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package System with Side Substrate Having a Top Layer
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 29, 2007
From: KIM, KYUNGOE; KANG, TAEWOO; SHIN, HYUNSU
To: STATS CHIPPAC LTD.
Reel/Frame 019502/0052 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0301 →
Release of Security Interest
Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0301. Assignor(S) Hereby Confirms the Change of Name.
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064913/0352 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →