Integrated circuit package system with side substrate having a top layer

1. A method for manufacturing an integrated circuit package system comprising:

providing a package substrate;

attaching an integrated circuit over the package substrate;

applying a fill layer between the integrated circuit and the package substrate;

attaching a side substrate having side substrate traces and a substrate connector, adjacent the integrated circuit and over the package substrate with the substrate connector on the package substrate, and leaving an unfilled gap between the integrated circuit and the side substrate, unfilled by the fill layer;

aligning a side substrate outer edge with a package substrate outer edge; and

attaching a heat spreader to the side substrate with a substrate attach layer.

2. The method as claimed in claim 1 wherein aligning the side substrate outer edge with the package substrate outer edge includes aligning along a vertical plane.

3. The method as claimed in claim 1 wherein attaching the side substrate includes attaching the side substrate having a circuit device.

4. The method as claimed in claim 1 wherein attaching the side substrate includes attaching the side substrate having side substrate traces.

5. The method as claimed in claim 1 wherein attaching the side substrate includes attaching the side substrate having a conductive layer substantially exposed.

6. A method for manufacturing an integrated circuit package system comprising:

providing a package substrate having package substrate traces;

attaching an integrated circuit over the package substrate;

applying a fill layer between the integrated circuit and the package substrate;

attaching a side substrate having side substrate traces and a substrate connector over a perimeter of the package substrate and adjacent to the integrated circuit with the integrated circuit connected to the package substrate traces and the side substrate traces, and leaving an unfilled gap between the integrated circuit and the side substrate, unfilled by the fill layer;

aligning a side substrate outer edge with a package substrate outer edge; and

attaching a heat spreader over the side substrate and the integrated circuit on a side opposite the package substrate with a substrate attach layer.

7. The method as claimed in claim 6 wherein aligning the side substrate outer edge with the package substrate outer edge includes aligning along a vertical plane.

8. The method as claimed in claim 6 wherein attaching the side substrate includes attaching the side substrate having a circuit device connected to the side substrate traces.

9. The method as claimed in claim 6 wherein attaching the side substrate includes attaching the side substrate having side substrate traces for distributed signal lines.

10. The method as claimed in claim 6 wherein attaching the side substrate includes attaching the side substrate having a conductive layer substantially exposed on a side substrate second surface opposite the package substrate.

11. An integrated circuit package system comprising:

a package substrate;

an integrated circuit over the package substrate;

a fill layer is between the integrated circuit and the package substrate and leaves an unfilled gap between the integrated circuit and the side substrate;

a side substrate having side substrate traces and a substrate connector, adjacent the integrated circuit and over the package substrate with the substrate connector on the package substrate and the side substrate having side substrate traces over a perimeter of the package substrate;

a side substrate outer edge aligned with a package substrate outer edge; and

a heat spreader attached to the side substrate with a substrate attach layer.

12. The system as claimed in claim 11 wherein the side substrate outer edge and the package substrate outer edge align along a vertical plane.

13. The system as claimed in claim 11 wherein the side substrate includes the side substrate having a circuit device.

14. The system as claimed in claim 11 wherein the side substrate includes the side substrate having side substrate traces.

15. The system as claimed in claim 11 wherein the side substrate includes the side substrate having a conductive layer substantially exposed.

16. The system as claimed in claim 11 wherein:

the package substrate has package substrate traces;

the integrated circuit is adjacent the side substrate over the package substrate, the integrated circuit connected to the package substrate traces and the side substrate traces; and

the heat spreader over the side substrate and the integrated circuit on a side opposite the package substrate.

17. The system as claimed in claim 16 wherein the side substrate outer edge and the package substrate outer edge align along a vertical plane.

18. The system as claimed in claim 16 wherein the side substrate includes the side substrate having a circuit device connected to the side substrate traces.

19. The system as claimed in claim 16 wherein the side substrate includes the side substrate having side substrate traces for distributed signal lines.

20. The system as claimed in claim 16 wherein the side substrate includes the side substrate having a conductive layer substantially exposed on a side substrate second surface opposite the package substrate.