IP Library Assignment 026934/0237
Patent Assignment
Reel/Frame 026934/0237

Security Agreement

Recorded: 2011-09-20 Pages: 15
Assignor
TAU-METRIX, INC.
Executed: 2010-08-09
Assignee
TEL VENTURE CAPITAL, INC.
3100 WEST WARREN AVENUE, FREMONT, CALIFORNIA, 94538
Covered Properties (14)
Technique for Evaluating a Fabrication of a Semiconductor Component and Wafer
Integrated Photodiode for Semiconductor Substrates
System and Apparatus for Using Test Structures Inside of a Chip During the Fabrication of the Chip
Patent: 7,256,055 →
Application: 10/927,258 →
Publication: US 2005/0090027
Technique for Evaluating a Fabrication of a Die and Wafer
Patent: 7,220,990 →
Application: 10/927,260 →
Publication: US 2005/0085032
Contactless Technique for Evaluating a Fabrication of a Wafer
Patent: 7,730,434 →
Application: 10/927,275 →
Publication: US 2005/0085932
Intra-Chip Power and Test Signal Generation for Use with Test Structures on Wafers
Patent: 7,339,388 →
Application: 10/927,406 →
Publication: US 2005/0090916
Test Structures for Evaluating a Fabrication of a Die or a Wafer
Patent: 8,344,745 →
Application: 11/469,305 →
Publication: US 2007/0004063
Technique for Evaluating a Fabrication of a Die and Wafer
Patent: 7,423,288 →
Application: 11/738,219 →
Publication: US 2007/0187679
System and Apparatus for Using Test Structures Inside of a Chip During the Fabrication of the Chip
Patent: 7,736,916 →
Application: 11/762,944 →
Publication: US 2007/0238206
System and Apparatus for Using Test Structures Inside of a Chip During the Fabrication of the Chip
Application: 11/763,001 →
Publication: US 2007/0236232
Intra-Chip Power and Test Signal Generation for Use with Test Structures on Wafers
Patent: 7,605,597 →
Application: 11/935,297 →
Publication: US 2008/0100319
System for Using Test Structures to Evaluate a Fabrication of a Wafer
Patent: 7,723,724 →
Application: 12/196,032 →
Publication: US 2008/0315196
Integrated Photodiode for Semiconductor Substrates
Patent: 8,410,568 →
Application: 12/547,463 →
Publication: US 2010/0084729
Contactless Technique for Evaluating a Fabrication of a Wafer
Patent: 8,990,759 →
Application: 12/791,665 →
Publication: US 2010/0304509
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2005
From: AGHABAZADEH, MAJID; ESTABIL, JOSE J.; PAKDAMAN, NADER; STEINBRUECK, GARY L.
To: TAU-METRIX, INC.
Reel/Frame 016604/0780 →
Assignment of Assignor's Interest Aug 2, 2005
From: AGHABABAZADEH, MAJID; ESTABIL, JOSE J.; PAKDAMAN, NADER; STEINBRUECK, GARY L.
To: TAU-METRIX, INC.
Reel/Frame 016604/0841 →
Assignment of Assignor's Interest Aug 2, 2005
From: AGHABABAZADEH, MAJID; ESTABIL, JOSE J.; PAKDAMAN, NADER; STEINBRUECK, GARY L.
To: TAU-METRIX, INC.
Reel/Frame 016604/0813 →
Assignment of Assignor's Interest Aug 2, 2005
From: AGHABABAZADEH, MAJID; ESTABIL, JOSE J.; PAKDAMAN, NADER; STEINBRUECK, GARY L.
To: TAU-METRIX, INC.
Reel/Frame 016604/0787 →
Assignment of Assignor's Interest Oct 20, 2006
From: AGHABABAZADEH, MAJID; PAKDAMAN, NADER; VICKERS, JAMES S; ESTABIL, JOSE J
To: TAU-METRIX, INC.
Reel/Frame 018417/0843 →
Assignment of Assignor's Interest Jun 14, 2007
From: AGHABABAZADEH, MAJID; ESTABIL, JOSE J; PAKDAMAN, NADER; STEINBRUECK, GARY L
To: TAU-METRIX, INC.
Reel/Frame 019429/0266 →
Assignment of Assignor's Interest Jun 14, 2007
From: AGHABABAZADEH, MAJID; ESTABIL, JOSE J; PAKDAMAN, NADER; STEINBRUECK, GARY L
To: TAU-METRIX, INC.
Reel/Frame 019429/0850 →
Assignment of Assignor's Interest Dec 16, 2009
From: STEINBRUECK, GARY L.; VICKERS, JAMES S.; PELELLA, MARIO M., PH.D; AGHABABAZADEH, MAJID
To: TAU-METRIX, INC.
Reel/Frame 023664/0225 →
Assignment of Assignor's Interest Dec 14, 2016
From: TAU-METRIX, INC.
To: TEL VENTURE CAPITAL, INC.
Reel/Frame 040736/0298 →
Assignment of Assignor's Interest Mar 7, 2017
From: TAU-METRIX, INC.
To: TEL VENTURE CAPITAL, INC.
Reel/Frame 041487/0259 →
Assignment of Assignor's Interest Mar 7, 2017
From: TAU-METRIX, INC.
To: TEL VENTURE CAPITAL, INC.
Reel/Frame 041480/0910 →