Patent Assignment
Reel/Frame 027102/0539
Assignment of Assignor's Interest
Recorded: 2011-10-21
Received: 2011-10-21
Pages: 5
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2011-09-30
Assignee
MICROSOFT CORPORATION
ONE MICROSOFT WAY, REDMOND, WA, 98052, UNITED STATES
Covered Properties
(21)
Single Chip Protocol Converter
Application:
12/189,675 →
FET Channel Having a Strained Lattice Structure Along Multiple Surfaces
Application:
11/969,992 →
FET Channel Having a Strained Lattice Structure Along Multiple Surfaces
Application:
11/970,011 →
Monomers and Polymers for Optical Elements
Application:
11/935,989 →
Hybrid Substrate Technology for High-Mobility Planar and Multiple-Gate Mosfets
Application:
11/866,786 →
System on Chip Ic with Subsystem of Multiple Processing Cores Switch Coupled to Network Protocol Device and Bus Bridge to Local System Bus
Application:
11/757,166 →
FET Channel Having a Strained Lattice Structure Along Multiple Surfaces
Application:
11/621,290 →
Method for Making a Fet Channel
Application:
11/137,811 →
Dual Function Finfet, Finmemory and Method of Manufacture
Application:
10/978,951 →
Finfet with Low Gate Capacitance and Low Extrinsic Resistance
Application:
10/711,170 →
Hybrid Substrate Technology for High-Mobility Planar and Multiple-Gate Mosfets
Application:
10/872,605 →
Startup System and Method Using Boot Code
Application:
10/841,902 →
Network Processor System on Chip with Bridge Coupling Protocol Converting Multiprocessor Macro Core Local Bus to Peripheral Interfaces Coupled System Bus
Application:
10/768,828 →
Multiprocessor Subsystem in Soc with Bridge Between Processor Clusters Interconnection and Soc System Bus
Application:
10/604,491 →
Fet Channel Having a Strained Lattice Structure Along Multiple Surfaces
Application:
10/626,760 →
Strained Fin Fets Structure and Method
Application:
10/439,886 →
Digital Logic with Reduced Leakage
Application:
10/437,764 →
Strained Fin Fets Structure and Method
Application:
10/405,844 →
Reducing Sub-Threshold Leakage in a Memory Array
Application:
10/361,200 →
Dense Dual-Plane Devices
Application:
10/248,123 →
Strained Fin Fets Structure and Method
Application:
10/101,807 →