Patent Assignment
Reel/Frame 027499/0058
Assignment of Assignor's Interest
Recorded: 2012-01-09
Pages: 6
Assignors
KIM, YOUNGCHUL
Executed: 2011-11-16
LEE, KYUNGHOON
Executed: 2011-11-16
PARK, SEONG WON
Executed: 2011-11-16
JANG, KI YOUN
Executed: 2011-11-16
LEE, JAEHYUN
Executed: 2011-11-16
YANG, DEOKKYUNG
Executed: 2011-11-16
YOON, IN SANG
Executed: 2011-11-16
PARK, SUNGEUN
Executed: 2011-11-16
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Connection Structure and Method of Manufacture Thereof
Integrated Circuit Packaging System Having Dual Side Connectivity and Method of Manufacture Thereof
Application:
61/414,419 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Jun 30, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053326/0240 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →