Integrated circuit packaging system with connection structure and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

forming a masking layer on the substrate;

patterning the masking layer to expose portions of the substrate;

forming a connection post on the substrate and in the masking layer, the connection post having a post top and a post side;

providing a protective coating on the post top;

forming a solder cap on the post top;

removing the masking layer;

mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and

forming a package body on the substrate, the connection post, a portion of the solder cap, and the integrated circuit die, wherein forming the package body includes:

providing a mold chase having an assist film;

positioning the assist film on the solder cap and the top die surface;

forming the package body in a single step with a moldable underfill between the assist film and the substrate and directly between the integrated circuit die and the substrate; and

completely removing the assist film and thereby exposing the solder cap on the post top and the top die surface from the package body.

2. The method as claimed in claim 1 further comprising attaching an external interconnect to the substrate.

3. The method as claimed in claim 1 wherein forming the solder cap on the post top includes forming the solder cap only on the post top.

4. The method as claimed in claim 1 wherein forming the solder cap on the post top includes forming the solder cap on the post top and a portion of the post side.

5. The method as claimed in claim 1 wherein forming the package body includes forming the package body with a portion of the solder cap in contact with the package body.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

forming a masking layer on the substrate;

patterning the masking layer to expose portions of the substrate;

forming a connection post on the substrate and in the masking layer, the connection post having a post top and a post side;

removing the masking layer;

mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface;

forming a solder cap on the connection post;

reflowing the solder cap on the post top and a portion of the post side; and

forming a package body on the substrate, the connection post, a portion of the solder cap, and the integrated circuit die, wherein forming the package body includes:

providing a mold chase having an assist film;

positioning the assist film on the solder cap and the top die surface;

forming the package body in a single step with a moldable underfill between the assist film and the substrate and directly between the integrated circuit die and the substrate, the package body in contact with a portion of the solder cap; and

completely removing the assist film thereby exposing the solder cap and the top die surface from the package body.

7. The method as claimed in claim 6 wherein forming the package body on the connection post includes forming a top package surface of the package body coplanar with the post top.

8. The method as claimed in claim 6 wherein forming the package body on the integrated circuit die includes forming a top package surface of the package body coplanar with the top die surface.

9. The method as claimed in claim 6 wherein attaching the connection post to the substrate includes attaching the connection post having the post top lower than the top die surface.

10. The method as claimed in claim 6 further comprising forming a connector recess in the package body by removing the package body around the connection post exposing a portion of the post side.