Patent Assignment
Reel/Frame 028241/0627
Assignment of Assignor's Interest
Recorded: 2012-05-21
Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2012-05-18
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Semiconductor Die and Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Corrective Assignment to Correct the Receiving Party Data from Stats Chippac Pte. Pte. to Stats Chippac Pte, Ltd. Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Change of Name.
May 30, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067567/0640 →