Patent Assignment
Reel/Frame 067567/0640
Corrective Assignment to Correct the Receiving Party Data from Stats Chippac Pte. Pte. to Stats Chippac Pte, Ltd. Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2024-05-30
Pages: 10
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Semiconductor Die and Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 21, 2012
From: PENDSE, RAJENDRA D.
To: STATS CHIPPAC, LTD.
Reel/Frame 028241/0627 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →