IP Library › Assignment 029178/0877
Patent Assignment
Reel/Frame 029178/0877

Assignment of Assignor's Interest

Recorded: 2012-10-24 Pages: 3
Assignors
NGUYEN, SON V.
Executed: 2012-10-20
PARUCHURI, VAMSI K.
Executed: 2012-10-22
PRIYADARSHINI, DEEPIKA
Executed: 2012-10-22
VO, TUAN A.
Executed: 2012-10-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Wafer Bonding for 3D Device Packaging Fabrication
Patent: 9,412,629 →
Application: 13/658,856 →
Publication: US 2014/0113433
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Jul 2, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0749 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →