Patent Assignment
Reel/Frame 029503/0548
Assignment of Assignor's Interest
Recorded: 2012-12-19
Pages: 6
Assignors
PARK, SEONGWON
Executed: 2012-12-12
JANG, KIYOUN
Executed: 2012-12-12
LEE, KYUNGHOON
Executed: 2012-12-12
LEE, JAEHYUN
Executed: 2012-12-12
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Reduced Surface Roughness in Molded Underfill for Improved C-SAM Inspection
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0418 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Corrective Assignment to Correct the Assignee's Name on Coversheet from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd." Previously Recorded on Reel 038378 Frame 0418. Assignor(S) Hereby Confirms the Change of Name.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064908/0920 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →