Patent Assignment
Reel/Frame 029617/0658
Assignment of Assignor's Interest
Recorded: 2013-01-11
Pages: 8
Assignors
DO, BYUNG TAI
Executed: 2013-01-09
TRASPORTO, ARNEL SENOSA
Executed: 2013-01-09
CHUA, LINDA PEI EE
Executed: 2013-01-09
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Molded Grid-Array Mechanism and Method of Manufacture Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0145 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Receiving Party Name on the Cover Sheet Previously Recorded at Reel: 038378 Frame: 0145. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0001 →