IP Library Assignment 029999/0543
Patent Assignment
Reel/Frame 029999/0543

Assignment of Assignor's Interest

Recorded: 2013-03-14 Pages: 8
Assignors
COLLINS, CHRISTOPHER N.
Executed: 2013-03-14
FAROOQ, MUKTA G.
Executed: 2013-03-14
GRAVES-ABE, TROY L.
Executed: 2013-03-14
LIU, JOYCE C.
Executed: 2013-03-14
PFEIFFER, GERD
Executed: 2013-03-14
TRAN-QUINN, THUY L.
Executed: 2013-03-14
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Electrical Leakage Reduction in Stacked Integrated Circuits Having Through-Silicon-via (Tsv) Structures
Patent: 8,907,494 →
Application: 13/826,628 →
Publication: US 2014/0264756
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →