IP Library › Assignment 030013/0691
Patent Assignment
Reel/Frame 030013/0691

Assignment of Assignor's Interest

Recorded: 2013-03-15 Pages: 2
Assignors
TENDULKAR, MIHIR
Executed: 2013-03-14
HIGUCHI, RANDALL
Executed: 2013-03-15
HSUEH, CHIEN-LAN
Executed: 2013-03-14
Assignee
INTERMOLECULAR, INC.
3011 N. FIRST STREET, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Metal Aluminum Nitride Embedded Resistors for Resistive Random Memory Access Cells
Patent: 8,853,661 →
Application: 13/835,256 →
Publication: US 2014/0264223
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2014
From: TENDULKAR, MIHIR; HIGUCHI, RANDALL; HSUEH, CHIEN-LAN
To: INTERMOLECULAR, INC.; KABUSHIKI KAISHA TOSHIBA; SANDISK 3D LLC
Reel/Frame 034043/0900 →
Assignment of Assignor's Interest Oct 17, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 040381/0032 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →