Patent Assignment
Reel/Frame 034043/0900
Assignment of Assignor's Interest
Recorded: 2014-10-27
Pages: 5
Assignors
TENDULKAR, MIHIR
Executed: 2014-09-16
HIGUCHI, RANDALL
Executed: 2014-10-23
HSUEH, CHIEN-LAN
Executed: 2014-10-25
Assignees
INTERMOLECULAR, INC.
3011 N. FIRST STREET, SAN JOSE, CALIFORNIA, 95134
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
SANDISK 3D LLC
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95034
Covered Property
(1)
Metal Aluminum Nitride Embedded Resistors for Resistive Random Memory Access Cells
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 15, 2013
From: TENDULKAR, MIHIR; HIGUCHI, RANDALL; HSUEH, CHIEN-LAN
To: INTERMOLECULAR, INC.
Reel/Frame 030013/0691 →
Assignment of Assignor's Interest
Oct 17, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 040381/0032 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →