Assignment of Assignor's Interest

Recorded: 2013-05-29 Pages: 9

Assignors

CHI, HEEJO

Executed: 2013-05-29

SHIN, HANGIL

Executed: 2013-05-29

CHO, NAMJU

Executed: 2013-05-29

KIM, KYUNG MOON

Executed: 2013-05-29

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Joint Assembly and Method of Manufacture Thereof

Patent: 9,748,157 →

Application: 13/904,401 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.