IP Library › Assignment 039848/0079
Patent Assignment
Reel/Frame 039848/0079

Change of Name

Recorded: 2016-08-26 Pages: 4
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Integrated Circuit Packaging System with Joint Assembly and Method of Manufacture Thereof
Patent: 9,748,157 →
Application: 13/904,401 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 29, 2013
From: CHI, HEEJO; SHIN, HANGIL; CHO, NAMJU; KIM, KYUNG MOON
To: STATS CHIPPAC LTD.
Reel/Frame 030504/0184 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →