Integrated circuit packaging system with joint assembly and method of manufacture thereof
An integrated circuit packaging system and method of manufacture thereof includes: a base substrate having a bottom pad; an integrated circuit device mounted on the base substrate; an interposer having a package interconnect mounted on the base substrate, the package interconnect includes an underside base portion having an irregular surface characteristic of a coining process; and an encapsulation between the interposer and the base substrate.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a base substrate having a bottom pad;
mounting an integrated circuit device on the base substrate;
providing an interposer having a package interconnect mounted thereon;
clamping the interposer to the base substrate, the package interconnect coined onto the bottom pad, the package interconnect coined to a fixed height allowing a set amount of clearance between the interposer and a device top side of the integrated circuit device, the interposer over the integrated circuit device with the package interconnect outside a perimeter of the integrated circuit device, and the package interconnect includes an irregular surface characteristic of a mechanical pressing method; and
forming an encapsulation between the interposer and the base substrate.
2. The method as claimed in claim 1 further comprising printing a pad solder paste on the bottom pad.
3. The method as claimed in claim 1 wherein forming the interposer includes forming an epoxy flux on the package interconnect.
4. The method as claimed in claim 1 wherein clamping the interposer includes coining the package interconnect to the fixed height of between 91 μm to 250 μm.
5. The method as claimed in claim 1 further comprising:
attaching an external interconnect to the base substrate; and
reflowing the package interconnect simultaneously during the attachment of the external interconnect.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a base substrate having a bottom pad;
mounting an integrated circuit device on the base substrate;
providing an interposer having a package interconnect, the interposer mounted directly on the package interconnect;
clamping the interposer to the base substrate, the package interconnect coined to the bottom pad at a fixed height allowing a set amount of clearance between the interposer and a device top side of the integrated circuit device, the interposer over the integrated circuit device with the package interconnect outside a perimeter of the integrated circuit device, and the package interconnect includes an irregular surface characteristic of a mechanical pressing method; and
forming an encapsulation between the interposer and the base substrate.
7. The method as claimed in claim 6 further comprising printing a pad solder paste on a pad top surface of the bottom pad for preventing mold flash on the bottom pad.
8. The method as claimed in claim 6 further comprising applying an epoxy flux to an underside of the package interconnect, the epoxy flux on an underside periphery portion of the package interconnect for preventing mold flash to the bottom pad.
9. The method as claimed in claim 6 further comprising applying an under-fill between the integrated circuit device and the base substrate.
10. The method as claimed in claim 6 further comprising reflowing the package interconnect for forming an intermetallic compound between the package interconnect and the base substrate.
11. An integrated circuit packaging system comprising:
a base substrate having a bottom pad;
an integrated circuit device mounted on the base substrate;
an interposer having a package interconnect mounted on the base substrate, the package interconnect at a fixed height allowing a set amount of clearance between the interposer and a device top side of the integrated circuit device, the interposer over the integrated circuit device with the package interconnect outside a perimeter of the integrated circuit device, and the package interconnect includes an underside base portion having an irregular surface characteristic of a mechanical pressing method; and
an encapsulation between the interposer and the base substrate.
12. The system as claimed in claim 11 further comprising a pad solder paste on the bottom pad.
13. The system as claimed in claim 11 further comprising an epoxy flux on the package interconnect.
14. The system as claimed in claim 11 wherein the package interconnect is coined to the fixed height of between 91 μm to 250 μm.
15. The system as claimed in claim 11 further comprising an external interconnect attached to the base substrate.
16. The system as claimed in claim 11 wherein the interposer is mounted directly over the package interconnect.
17. The system as claimed in claim 16 further comprising a pad solder paste directly on a pad top surface of the bottom pad.
18. The system as claimed in claim 16 wherein the epoxy flux is on an underside periphery portion of the package interconnect for preventing mold flash on the bottom pad.
19. The system as claimed in claim 16 further comprising an under-fill between the integrated circuit device and the base substrate.
20. The system as claimed in claim 16 wherein the encapsulation has a mold temperature lower than a melting temperature of the package interconnect.