Patent Assignment
Reel/Frame 030657/0236
Assignment of Assignor's Interest
Recorded: 2013-06-21
Pages: 4
Assignors
OZKOK, MUSTAFA
Executed: 2013-06-11
RAMOS, GUSTAVO
Executed: 2013-06-21
KILIAN, ARND
Executed: 2013-06-13
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method for Obtaining a Palladium Surface Finish for Copper Wire Bonding on Printed Circuit Boards and Ic-Substrates
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →