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Patent Assignment
Reel/Frame 031848/0985

Assignment of Assignor's Interest

Recorded: 2013-12-26 Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2013-10-11
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property (1)
Integrated Circuit Having Staggered Bond Pads and I/O Cells
Patent: 9,054,084 →
Application: 13/716,479 →
Publication: US 2013/0127061
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Change of Name Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →