Patent Assignment
Reel/Frame 031996/0310
Assignment of Assignor's Interest
Recorded: 2014-01-17
Pages: 6
Assignors
CHOCKANATHAN, VINOTH KANNA
Executed: 2014-01-02
ZHAO, XING
Executed: 2014-01-02
NA, DUK JU
Executed: 2014-01-02
YONG, CHANG BUM
Executed: 2014-01-02
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Wafer Thinning Involving Edge Trimming and Cmp
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →